Semester : 1 |
|
Subject Type |
Subject No |
Subject Name |
L-T-P |
Credit |
|
Depth CORE I
|
EC60307 |
ADVANCED SEMICONDUCTOR DEVICES |
3-0-0 |
3 |
|
Depth CORE II
|
EC60309 |
VLSI PROCESS TECHNOLOGY |
3-0-0 |
3 |
|
Depth CORE III
|
EC61215 |
ANALOG AND MIXED-SIGNAL CIRCUITS |
3-1-0 |
4 |
|
Depth CORE IV
|
EC69213 |
VLSI CIRCUITS AND SYSTEMS LABORATORY |
0-0-3 |
2 |
|
Depth CORE V
|
EC69207 |
SEMINAR-I |
0-0-3 |
2 |
|
DEPTH ELECTIVE I
|
|
|
|
|
|
DEPTH ELECTIVE II
|
|
|
|
|
Semester : 2 |
|
Subject Type |
Subject No |
Subject Name |
L-T-P |
Credit |
|
Depth CORE IX
|
EC69216 |
VLSI DESIGN LABORATORY |
0-0-3 |
2 |
|
Depth CORE VI
|
EC60204 |
DIGITAL VLSI CIRCUITS |
3-1-0 |
4 |
|
Depth CORE VII
|
EC61202 |
CAD FOR VLSI |
3-1-0 |
4 |
|
Depth CORE VIII
|
EC69214 |
VLSI TECHNOLOGY AND PROCESS MODELLING LAB |
0-0-3 |
2 |
|
DEPTH/BREADTH ELECTIVE I
|
|
|
|
|
|
DEPTH ELECTIVE III
|
|
|
|
|
|
DEPTH ELECTIVE IV
|
|
|
|
|
|
PROJECT I
|
|
|
|
|
Semester : 3 |
|
Subject Type |
Subject No |
Subject Name |
L-T-P |
Credit |
|
Depth CORE X
|
EC68221 |
SUMMER INTERNSHIP |
0-0-6 |
4 |
|
BREADTH ELECTIVE I
|
|
|
|
|
|
PROJECT II
|
|
|
|
|
Semester : 4 |
|
Subject Type |
Subject No |
Subject Name |
L-T-P |
Credit |
|
PROJECT III
|
|
|
|
|